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Excimer laser micromachining system

The LLG develops customized excimer laser micromachining systems for research, teaching and special applications. These systems are adapted to the customer's special requests and can be optimized for wavelengths ranging from 157 nm to 308 nm. The integration of individual system components is implemented with the help of a LabVIEW control and exhibits therefore a high degree of automation. The systems contain the following modules depending upon need:

F2-laser micromachining system at work
  • Beam shaping (variable attenuator, beam homogenizer)
  • Beam analysis (energy, profile)
  • Mask system (variable aperture, dielectric masks)
  • Mask projection optics (lens objective, reflective objective)
  • Workpiece positioning system (translation, rotation)
  • Design- and controlsoftware