Thin film patterning

Besides bulk material removal by laser ablation, which is applied e.g. for hole drilling or three-dimensional shaping of surfaces, laser ablation of thin layers becomes more and more important. Especially the textured removal of hard oxide layers without damaging the underlying substrate opens a wide field of applications. In this way dielectric masks, diffractive elements, phase masks or phase plates can be fabricated in a simple and flexible way. Several methods of film patterning have been developed and optimized especially with regard to the fabrication of UV-grade elements.

Laser-patterned dielectric SiO2/Al2O3 multilayer stack

A two step process comprising the laser patterning of UV absorbing substoichiometric SiO_x layers and subsequent oxidation to SiO₂ enables the fabrication of structured fused silica components.

Two step process for the fabrication of patterned quartz surfaces

Further information:

Malte Schulz-Ruhtenberg, Jürgen Ihlemann, Jörg Heber
Laser patterning of SiO_X-layers for the fabrication of diffractive phase elements for deep UV applications
Appl. Surf. Sci. 248, 190 (2005)

M. Jahn, J. Richter, R.Weichenhain-Schriever, J. Meinertz, J. Ihlemann
Ablation of silicon suboxide thin layers
Applied Physics A 101, 533 (2010)